Dateien

Gerber, Protel, Powerpcb, Autocad, Orcad, usw.

Material

FR-4, Hi-Tg FR-4, Lead free Material (RoHS konform), CEM-3, CEM-1, Aluminium, Hochfrequenz-material

Schicht Nr.

1-20 Schichten

Dicke der Toleranz

±10%

Kupferdicke

0,5 OZ - 5 OZ

Impedanzkontrolle

±10%

Verzug

0.075%~1.5%

Abziehbare

0.012andquot;(0.3mm)~0.02and#39;and#39;(0.5mm)

Min-Trace-Wildth(a)

3mil(0.0762mm)~4mil(0.1mm)

Min Space Width(b)

3mil(0.0762mm)~4mil(0.1mm)

Min Restring

0,15 mm

Min BGA Pitch(b)

0,25 mm

Min Lot Maske Dam(a)

0.005andquot;(0.125mm)

Solder Mask clearance(b)

0.005andquot;(0.125mm)

Min SMT Pad Abstand

0.004andquot;(0.1mm)

Löten von Nask Dicke

0.0007andquot;(0.018mm)

Lochgröße

0.01andquot;(0.25mm)~0.257andquot;(6.5mm)

Loch Größe Tol(±)